| ·
2008 | Line Width/Spacing
Achievable drill hole size
High
Layer Count
PCB Type
Impedance control
Surface Finish
Lead Free Process
Study | 4 mil / 4 mil
0.25mm
10 Layer
Selective plating/Green
material
(50-100)Ω±10%
Aluminium base laminate
RoHS compliance Halogen
free laminate |
|
|
| ·
2009 | Line Width/Spacing
Achievable
drill hole size
High Layer Count
PCB Type
Impedance control
Surface
Finish
Lead Free Process Study | 3mil/3mil
0.2mm
10Layer
Fine
Line PCB
(50-100)Ω±10%
Combination of Various surface finishing
|
|
|
| ·
2010 | Line Width/Spacing
Achievable drill hole size
High
Layer Count
PCB Type
Impedance control
Surface Finish
Lead Free Process
Study | 2mil/2mil
0.2mm
12Layer
HDI
(50-100)Ω±5%
|
|
|
| ·
2011 | Line Width/Spacing
Achievable
drill hole size
High Layer Count
PCB Type
Impedance control
Surface
Finish
Lead Free Process Study | 2mil/2mil
0.2mm
12Layers
(50-100)Ω±5%
|
|
|
| Remark:
In past 2 years, we established the RoHS compliance process in mass production(Immersion
tin,Immersion silver, Lead-free HASL). |
