|
| Material
: FR4,CEM1,CEM3,ARLON Special Material On Request(BT,Roger,Telfon etc.) |
|
| Finish
Board Thickness: 0.20mm~6.00mm (8mil~236mil) |
|
| Minimum
Core Thickness: 0.1mm(4 mil) |
|
| Copper
Thickness: min.1/2 OZ,max.3 OZ Selective Plating |
|
| Min.Trace
Wide &Line Space |
|
| Single Sided: 0.100mm(4 mil)
|
|
| Double Sided 0.100mm(4 mil) |
|
|
| Drilling /PTH: φ0.25mm(10 mil)
|
|
| Punching: φ0.90mm(36 mil) |
|
|
| Hole Position: ±0.075 ( 3 mil
) |
|
|
| Hole Diameter(H) : ±0.03 mm (
1.2 mil )[ With PTH ±0.05 mm ( 2 mil ) ] |
|
| Outline Dimension" ±0.10
mm ( 4 mil ) |
|
| Conductors & Outline:(C-O)
±0.15 mm ( 6 mil ) |
|
|
| Surface
Treatment On Land Area: Nickel/Gold Plate/Immersion Gold/Immersion |
|
Sliver/O.S.P/HASL/Lead
Free HASL |
|
| Isolation
for electrical test: >10MΩ |
|
| Continuity
for electrical test: 25-50Ω |
|
| Test
voltage for electrical test: 250V(max) |
|
| Minimun
pitch for electrical test: 0.3 mm (12mil ),0.2 mm ( 8mil ) with conductive robber |
|
|
| Panel Size: 110 mm X 100 mm (
min. ) |
|
| Board Thickness: 0.40 mm (16mil)
min. |
|
| Remain Thickness: 0.20 mm (8mil)
min. |
|
|
|
