| Groove
Width : 0.50 mm (20mil) max. |
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| Groove
to Groove: 15 mm (590mil) min |
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| Groove
to Trace: 0.45 mm(18mil) min. |
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| Slot
size tol.L≥2W L：±0.15(6mil) W：±0.10(4mil) |
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| Slot
size tol.L≥2W NPTH slot(mm) L：±0.125(5mil) W：±0.075(3mil) |
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| Minimum
spacing between hole edge to hole edge |
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| Minimum
spacing between hole edge to circuitry pattern |
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| Image
transfer Registration tolerance |
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| Circuit
pattern vs.index hole: ±0.075(3mil) |
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| Circuit
patten vs. 2nd drill hole: ±0.10(4mil) |
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| Registration
toleranceof front/back image: Front image vs back image: 0.075mm(3mil)
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| Layer-layer
misregistration:4layers:0.15mm(6mil)max. |
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| Layer-layer
misregistration:6layers:0.2mm(8mil)max |
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| Layer-layer
misregistration:8layers:0.25mm(10mil)max. |
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| Min.
spacing between board outline to circuitry pattern of an inner-layer: 0.225mm(9mil) |
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| Min.
board thickness:4layers:0.35mm(14mil) |
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| Min.
board thickness:6layers:0.60mm(23.6mil) |
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| Min.
board thickness:8layers:1.00mm(40mil) |
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| Board
thickness tolerance:4layers:+/-0.13mm(5mil) |
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| Board
thickness tolerance:6layers:+/-0.15mm(6mil) |
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| Board
thickness tolerance:8layers:+/-0.15mm(6mil) |
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| Impedance
control Typical: 50Ω+/-10% |
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